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Principal Engineer, Packaging Engineering

Location: Bangalore, KA, India 
Req ID: JR-9999033111

Description

Principal Engineer


Location:  Bangalore India

Req Id: JR-9999033111 


Western Digital®


We deliver the possibilities of data. YOU define what’s possible.


Roles and responsibilities:


ASIC PID: integration of ASIC design team, package team, test team, reliability team etc

Assembly process risk evaluation for new ASIC.

ASIC assembly evaluation for high risk process.

ASIC assembly process and material optimization.

ASIC device evaluation after package.

 

Skills/Experience:


Master degree in microelectronic science and technology or in material science and technology.

Good communication skills, be fluent both in oral and written English and work with multiple teams worldwide.

Basic understanding of assembly process flow & materials and wafer fabrication processes.

Basic knowledge of operation principle for NAND/DDR/ASIC.

Basic Computer & Microsoft Office skills are required, AutoCAD/Cadence/JMP are preferred.

Be capable of analyzing SEM/FIB/TEM/EDX results and inferring outcomes.

Good communication/team work/planning skills.

Be capable of occasionally over time work and overseas business travel.


ABOUT WESTERN DIGITAL

Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.