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Senior Engineer, Packaging Engineering

Location: Shanghai, 31, China 
Req ID: JR-9999035990


Western Digital

We deliver the possibilities of data.  YOU define what's possible.


Minimum of 3 years of mechanical outline & tooling drawing using autoCAD is required. The ability to work with substrate and other laminate material suppliers is a prefer.
Explore routing and placement changes that could lower the substrate complexity and cost.
Provide substrate layout feasibility and documentation for laminate package designs.
Perform Design Library maintenance and bonding diagram generation.
Perform cost/performance trade–off analysis of various packages either in production or under development.
Interface seamlessly with product managers, substrate designers, manufacturing and assembly engineering and layout groups at the assembly subcontractors. Work closely with various manufacturing and packaging groups at various SanDisk locations for new product development and substrate / PCB design improvement. Work with assembly houses and substrate / PCB vendors on design review and design rule maintenance.

It is better to have substrate design experience using Cadence APD.


At the forefront of flash memory storage, industry-leading SanDisk-branded integrated and embedded solutions deliver the possibilities of data for data centers and mobile devices, enabling fast and reliable data access. SanDisk, WD, HGST and G-Technology brands position Western Digital as the world's target data storage company and flash memory leader. 

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