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Wafer Process R&D Metrology Engineer

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Location: San Jose, CA, United States 
Req ID: JR-0000037775

Description

Responsible for developing advanced metrology solution for CD, profile, film thickness and topography using FIB (focused Ion Beam) and CDSEM.   Candidate is expected to work closely with heads process R&D engineers to develop the new metrology solution with advanced algorithm, and to support daily metrology measurement operation for all development projects.  Candidate will be part of  a R&D team that provide all aspects of metrology support for R&D of advanced magnetic recording heads process, and work in collaboration with the another dedicated manufacture metrology team.

 

 

 

  • MS/PH.D degree in one of following areas: Physics, Materials Science or other related science fields.
  • Experiences in the metrology field to support research and development or manufacture in high tech industry or a related research environment.  Familiar with metrology technology such as AFM, FIB, SEM, TEM.
  • Have good data analysis experience utilizing industry standard solutions.
  • Experience with programming language such as MatLab or other high level program languages for customized metrology algorithms development.
  • Effective communication skill in all aspects.  Proficient in English in speaking, and writing.
  • Must be a team player.