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Wafer Process R&D Metrology Engineer

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Location: San Jose, CA, United States 
Req ID: JR-0000037775


Responsible for developing advanced metrology solution for CD, profile, film thickness and topography using FIB (focused Ion Beam) and CDSEM.   Candidate is expected to work closely with heads process R&D engineers to develop the new metrology solution with advanced algorithm, and to support daily metrology measurement operation for all development projects.  Candidate will be part of  a R&D team that provide all aspects of metrology support for R&D of advanced magnetic recording heads process, and work in collaboration with the another dedicated manufacture metrology team.




  • MS/PH.D degree in one of following areas: Physics, Materials Science or other related science fields.
  • Experiences in the metrology field to support research and development or manufacture in high tech industry or a related research environment.  Familiar with metrology technology such as AFM, FIB, SEM, TEM.
  • Have good data analysis experience utilizing industry standard solutions.
  • Experience with programming language such as MatLab or other high level program languages for customized metrology algorithms development.
  • Effective communication skill in all aspects.  Proficient in English in speaking, and writing.
  • Must be a team player.