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Principal Engineer, Product Design Engineering

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Location: Shanghai, 31, China 
Req ID: JR-0000038329


Responsibilities:Performing deep electrical failure analysis during new product development and ramping phase. Shoot failures from both wafer level and package level. Create analysis report based on FA finding and define the action plans after communication with stockholders (Device engineer, Design engineers, Fab product engineer, etc.)Monitor memory health level and DPPM pareto for miscellaneous product lines. Work with FAB/device to improve and fine tune the fab process for DPPM reduction.Define the test flow, screen/stress method based on root cause analysis of failures. Work with TE to come up with detail plans and drive for implementation.Requirement:BS or higher in Electrical Engineering, Computer Engineering, Physics, Materials Science or other related technical field;Deep understanding on electrical failure analysis methodology. 2-4 years of hands-on trouble shooting experience on memory products or system;Demonstrated ability to analyze problems, diagnose root cause, and apply corrective actions;Excellent data analysis skills including data crunch, statistical analysis, and interpretationHighly self-motivated, passionate about troubleshooting and solving complex problemsA basic understanding of system, F/W working principle, device physicsis beneficialGood English communication skill#LI-FF1