Senior Engineer, Packaging Engineering
Location: Minhang Shanghai
Req ID: JR-0000039040
We deliver the possibilities of data. YOU define what’s possible.
ESSENTIAL DUTIES AND RESPONSIBILITIES:
DP process evaluation for 3D NAND wafer assembly. New DP process recipe development to achieve high quality product and cost down. New DP technology (plasma thinning) evaluation and introduction. Co-work with material team with new package related material evaluation. Co-work with objective owner to handle new product DP process.
ABOUT WESTERN DIGITAL3
Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.