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Principal Engineer, Product Design Engineering

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Location: Shanghai, 31, China 
Req ID: JR-0000040292


Western Digital®
We deliver the possibilities of data. YOU define what’s possible.
  • Performing deep electrical failure analysis during new product development and ramping phase.
  • Shoot failures from both wafer level and package level.
  • Create analysis report based on FA finding and define the action plans after communication with stockholders (Device engineer, Design engineers, Fab product engineer, etc.)
  • Monitor memory health level and DPPM pareto for miscellaneous product lines.
  • Work with FAB/device to improve and fine tune the fab process for DPPM reduction.
  • Define the test flow, screen/stress method based on root cause analysis of failures.
  • Work with TE to come up with detail plans and drive for implementation
  • Bachelor degree or higher in Computer Engineering, electrical engineering, Materials Science or other related technical field.
  • Deep understanding on electrical failure analysis methodology
  • 2-4 years of hands-on trouble shooting experience on memory products or system
  • Demonstrated ability to analyze problems, diagnose root cause, and apply corrective actions
  • Excellent data analysis skills including data crunch, statistical analysis, and interpretation
  • Highly self-motivated, passionate about troubleshooting and solving complex problems
  • A basic understanding of system, F/W working principle, device physics beneficial
Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.