Responsible for support wafer process development of magnetic recording heads with broad range of metrology solutions in the area of CD, profile, film thickness and topography. Candidate will have a chance to work with the metrology tool sets such as optical interferometer, CDSEM, AFM and FIB (Focused Ion Beam). Candidate will be a part of metrology team to work closely with heads process R&D engineers to develop the new metrology solution with advanced algorithm, and to support daily metrology measurement operation for all development projects. Candidate will also need to work in collaboration with the manufacture metrology team.
- MS/PH.D degree in one of following areas: Physics, Materials Science or other related science and engineer fields with demonstrated ability to learn quickly.
- Experiences in optical metrology is especially desired. Previous experience in any of the areas of CDSEM, OCD, FIB, TEM and AFM is a plus.
- Have good data analysis experience utilizing industry standard solutions.
- Effective communication skill in all aspects. Proficient in English in speaking, and writing.
- Must be a team player.