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Staff Engineer, Packaging Engineering

Location: Taichung, TXG, Taiwan 
Req ID: JR-0000040576


Staff Engineer, Packaging Engineering

Location: Taichung City, Taiwan
Req ID: JR-0000040576

Western Digital®

We deliver the possibilities of data. YOU define what’s possible.



  • Explore routing and placement changes that could lower the substrate complexity and cost.
  • Provide substrate layout feasibility and documentation for laminate package designs.
  • Perform Design Library maintenance and bonding diagram generation.
  • Perform cost/performance tradeoff analysis of various packages either in production or under development.
  • Interface seamlessly with product managers, substrate designers, manufacturing and assembly engineering and layout groups at the assembly subcontractors. 
  • Work closely with various manufacturing and packaging groups at various WD locations for new product development and substrate / PCB design improvement. 
  • Work with assembly houses and substrate / PCB vendors on design review and design rule maintenance.


  • Bachelor's Degree or above, minimum of 3 years of mechanical outline & tooling drawing by auto CAD is required. 
  • Good command of oral and written English.
  • Skillful in project management, good at working with substrate and other laminate material suppliers. 
  • Logical thinking, good team spirit. 
  • A plus to have substrate design experience in using Cadence APD.


Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.