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Senior Engineer, Failure Analysis Engineering

Location: Seberang Perai Selatan, Pulau Pinang (Penang), Malaysia 
Req ID: JR-0000042970


Senior Engineer, Failure Analysis Engineering

Location: Batu Kawan, Penang


  • Perform package and device analysis on assembly test defect from production and qualification on semi-finished or finished products. 
  • Define the FA flow for each FA case. 
  • Generate FA report and assist process engineer for root-causing of defect/s. 
  • Maintain the FA tracking sheet and FA equipment logsheet. 
  • Develop the FA process and FA capability for new product and new technologies.



·        Bachelor Degree and/or Master in Electrical/ Electronic/Material Science/Chemistry with minimum 5 years in failure analysis

·        Familiar with package and device analysis methodology

·        Familiar with semiconductor and SMT assembly process and technology

·        Familiar with memory product technology and structure

·        Understand memory product test process and methodology

·        Skillful in performing failure analysis with FA tools or methodology such as 3D X-ray, CSAM, SEM/EDX, chemical decapsulation, TDR, curve tracer analysis, optical microscopes, FIB

·        Strong memory IC de-processing skills

·        Good communication and presentation skills

·        Good teamwork spirit

·        Fluent in English speaking, reading and technical FA report writing

·        Previous electrical FA experience in IC or memory devices is preferred


Generic & Functional Skills / competencies


Technical report writing and presentation skills



Western Digital Corporation is the world’s largest data storage company with a leading portfolio of HGST, SanDisk, G-Technology and WD brands covering flash and disk-based solutions. Deployed by the largest and most prominent organizations worldwide, Western Digital solutions are everywhere, touching lives and enabling great value from the data they possess.