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Engineer, Product Design Engineering

Location: Shanghai, 31, China 
Req ID: JR-0000043285


Be responsible for flash memory test program development, units failure analysis and device issue debug;Be responsible for NAND Product and Package Qualification/Reliability tests setup/eFA/Action Plan;Providing correct test condition for the memory product and generate defined test flow for volume testing needs;Product Evaluation DOE for Reliability/DPPM improvement and D/S and KGD Sort Yield improvement;Run the test time analysis to get a lowest cost test method in order to reach short test time and high testing coverage;Define/improve testing method to deal with new product introduced to mass production and marketing;Deliver a world class throughput time on the testing code development to reach the most effective way of sample delivery TPT (Through Put Time);Work with multinational team to complete assigned projects in PDT (product development team) required time.