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Senior Engineer, Packaging Engineering

Location: Shanghai, 31, China 
Req ID: JR-0000043299


PRINCIPLE DUTIES AND RESPONSIBILITIES: Bilingual needed主要工作职责:(描述具体的工作职责) 要求中英双语混合芯片倒装产品制程开发,以及量产导入;Process development for Flip Chip & Hybrid packaging product from new product qualification, to low volume production;芯片倒装工艺的控制和优化改善;Flip Chip Process Control & Optimization新产品设计、风险评估,以及产品开发;New Product design, assessment & developREQUIREMENTS职位要求: (Qualifications, experience and functional skills/competencies that are essential for the position) (描述此岗位所要求的重要资质,经验和工作技能或能力) Qualifications, experience资质和经验 Bilingual needed要求中英双语Education 教育背景半导体/材料/工程/机械类专业硕士Master Degree in Semiconductor, Material, engineering, MechanicsKnowledge 专业知识具有材料特性分析和机械,热应力方面的知识Have knowledge of Material science and its mechanical and thermal characteration 熟悉试验和分析,以及统计分析Familiar with Statistical AnalysisCompetencies & Soft Skill 能力和技能工作沟通需流畅的英文交流(读写、口语)能力Excellent English communication (written and verbal) and interpersonal skills对工作需求和环境变化的适应性Ability to achieve results in a fast changing and demanding working environment.需要一定的加班和海内外出差Be capable of occasionally over time work and oversea business travel.良好的交流、团队合作和规划能力Good communication/team work/planning skills.良好的办公软件、统计分析软件使用能力Good Computer & Microsoft Office skills are required, Static Analysis is required (JMP, Weibull).